SIPLACE TX micron
High speed and high accuracy for submodules and SiPs
With an accuracy down to 15 μm at 3 sigma, the new SIPLACE TX micron modules operate with top accuracy. Thanks to the careful selection of hardware components like high-resolution measurement scales made of glass ceramics and sophisticated software algorithms, every module will ensure a superior product yield at all times.
This unique combination of accuracy and record-breaking speed of up to 96,000 cph makes the SIPLACE TX micron the clear winner in the race for high-volume and high accurate placing of modules, system-in- packages and other applications focusing on miniaturization.
Highlights:
- Placement speed up to 96,000 cph
- Placement accuracy 25/20 µm @ 3 sigma down to 15 μm (equipped with vacuum tooling)
- PCB dimensions (l x w)
Dual: 50 mm x 45 mm to 375 mm x 260 mm
With vacuum tooling (for 15 µm): 50 mm x 55 mm to 250 mm x 100 mm
Single: 50 mm x 45 mm to 375 mm x 460 mm - Small footprint: 1.00 m x 2.23 m x 1.45 m
- Feeder slots up to 80 x 8 mm, Jedec Tray
- Certifications: Semi S2/S8, clean room class ISO 7
- Minimum placement force: 0.5 N for sensitive components
- Touchless placement: Highest placement quality for highly sensitive components
- Linear Dipping Unit with inspection via vision system and auto cavity
NEW for the SIPLACE TX micron: SIPLACE Tray Unit
SIPLACE Tray Unit enables non-stop feeding of components in a tray with a compact design. Maximum flexibility characterized by the following points:
- Productivity: Non-stop refilling, fast carrier changeover
- Storage capacity: 30 levels in main storage+ 12 levels in cache storage
- Large tray capacity: 355mm x 275mm (2x JEDEC per level )
- Footprint: Minimized protrusion
- Random setup: RFID on each layer
- Clarity: LED indicator for each level
Related topics
SIPLACE TX
Faster, smaller, more advanced – the new high-end placement solution