High speed and high accuracy for submodules and SiPs

With an accuracy down to 15 μm at 3 sigma, the new SIPLACE TX micron modules operate with top accuracy. Thanks to the careful selection of hardware components like high-resolution measurement scales made of glass ceramics and sophisticated software algorithms, every module will ensure a superior product yield at all times.

This unique combination of accuracy and record-breaking speed of up to 96,000 cph makes the SIPLACE TX micron the clear winner in the race for high-volume and high accurate placing of modules, system-in- packages and other applications focusing on miniaturization.


  • Placement speed up to 96,000 cph
  • Placement accuracy 25/20 µm @ 3 sigma down to 15 μm (equipped with vacuum tooling)
  • PCB dimensions (l x w)
    Dual: 50 mm x 45 mm to 375 mm x 260 mm
    With vacuum tooling (for 15 µm): 50 mm x 55 mm to 250 mm x 100 mm
    Single: 50 mm x 45 mm to 375 mm x 460 mm
  • Small footprint: 1.00 m x 2.23 m x 1.45 m
  • Feeder slots up to 80 x 8 mm, Jedec Tray
  • Certifications: Semi S2/S8, clean room class ISO 7
  • Minimum placement force: 0.5 N for sensitive components
  • Touchless placement: Highest placement quality for highly sensitive components
  • Linear Dipping Unit with inspection via vision system and auto cavity

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Faster, smaller, more advanced – the new high-end placement solution

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