SIPLACE TX
Faster, smaller, more advanced – the new high-end placement solution
The latest generation of our placement modules sets new records in speed, floorspace performance and accuracy for high-volume production applications. And for the first time, 0201 (metric) components can be placed at the highest speed.
SIPLACE TX highlights:
- SIPLACE SpeedStar placement head, with an accuracy rating of up to 25 µm/3 sigma
- SIPLACE MultiStar: Up to 25,500 cph
- SIPLACE TwinStar: The head for special tasks
- SIPLACE JEDEC Tray Feeder: With up to 18 JEDEC trays
- ASM Shuttle Extension: Active transport unit for easy handling of single and dual conveyors
- SIPLACE TX micron: Placement accuracy of up to 15 µm @ 3 sigma
- More flexibility and performance through the combination of SIPLACE SpeedStar and SIPLACE MultiStar heads in a single placement area
- NEW: SIPLACE SpeedStar with up to 48,000 cph and maximum component size of 8.2 mm x 8.2 mm x 4 mm
- NEW: Placement force as low as 0.5 N for sensitive components
- NEW: Touchless placement: Maximum placement quality for highly sensitive components
- NEW: SIPLACE Smart Pin Support: Automated pin support for printed circuit boards
- NEW: Maximum PCB size 550 mm x 460 mm
Related topics
SIPLACE JEDEC Tray Feeder
Flexible component supply
ASM Shuttle Extension
ASM transport extensions for reliable and smart PCB handling
SIPLACE SX
Our placement solution for high-mix electronics production
SIPLACE SpeedStar
Extremely fast and with long-term precision
SIPLACE TX micron
High speed and high accuracy for submodules and SiPs
SIPLACE Pro
Create, verify and optimize placement programs