SIPLACE TX
Faster, smaller, more advanced – the new high-end placement solution
The latest generation of our placement modules sets new records in speed, floorspace performance and accuracy for high-volume production applications. And for the first time, 0201 (metric) components can be placed at the highest speed.
SIPLACE TX highlights:
- NEW: SIPLACE SpeedStar with up to 48,000 cph and maximum component size of 8.2 mm x 8.2 mm x 4 mm with a placement accuracy of up to 25 µm/3 sigma
- SIPLACE MultiStar: Up to 25,500 cph
- SIPLACE TwinStar: The head for special tasks
- SIPLACE JEDEC Tray Feeder with up to 18 JEDEC trays
- SIPLACE TX micron: Placement accuracy of up to 15 µm @ 3 sigma
- More flexibility and performance through the combination of SIPLACE SpeedStar and SIPLACE MultiStar heads in a single placement area
- Placement force down to 0.5 N for sensitive components
- Touchless placement: Maximum placement quality for highly sensitive components
- NEW: SIPLACE Smart Pin Support: Automated pin mounting for printed circuit boards
- NEW: Maximum PCB size 550 mm x 460 mm
Related topics
SIPLACE SpeedStar
Extremely fast and with long-term precision
SIPLACE MultiStar
The first head that changes its mode on demand
SIPLACE JEDEC Tray Feeder
Flexible component supply
SIPLACE TX micron
High speed and high accuracy for submodules and SiPs