Master all challenges


With SIPLACE equipment, the perfect interaction between placement head and vision system makes it easy to master the challenges posed by OSCs.

  • Placement forces of up to 100 N
  • Snap-in recognition
  • Real-time 3D measurement of contact pins
  • Automatic placement speed optimization
  • Automatic illumination setting for OSC components
  • Crack detection -Component cracks can be identified via the PCB camera inspection prior to pick up as shown in the pictures (i.e. at bare dies)
  • Component weight up to 300 g 
  • NEW: Measure moment of inertia

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Best-in-class solutions

As the industry’s technology leader, ASM offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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