SIPLACE OSC Package
Master all challenges
With SIPLACE equipment, the perfect interaction between placement head and vision system makes it easy to master the challenges posed by OSCs.
- Placement forces of up to 100 N
- Snap-in recognition
- Real-time 3D measurement of contact pins
- Automatic placement speed optimization
- Automatic illumination setting for OSC components
- Crack detection -Component cracks can be identified via the PCB camera inspection prior to pick up as shown in the pictures (i.e. at bare dies)
- Component weight up to 300 g
- NEW: Measure moment of inertia
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