ENABLING THE DIGITAL WORLD

SIPLACE OSC Package

Master all challenges

With SIPLACE equipment, the perfect interaction between placement head and vision system makes it easy to master the challenges posed by OSCs.

  • Placement forces of up to 100 N
  • Snap-in recognition
  • Real-time 3D measurement of contact pins
  • Automatic placement speed optimization
  • NEW: Automatic illumination setting for OSC components
  • NEW: Crack detection -Component cracks can be identified via the PCB camera inspection prior to pick up as shown in the pictures (i.e. at bare dies)

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Best-in-class solutions

Good planning is the basis for efficiency, flexibility and quality in electronics production. As the industry’s technology leader, we offer a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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