ENABLING THE DIGITAL WORLD

SIPLACE CA

Chip assembly and SMT placement in a single machine

Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the SIPLACE CA, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement. Your competitive advantage: New, future-proof applications can be implemented on a single SMT line without any additional special processes. It is the ideal machine for “Advanced Packaging” applications. Another benefit: For all other jobs, the SIPLACE CA operates as a powerful “normal” SMT placement machine.

Highlights of the SIPLACE CA:

  • With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour
  • Component supplied from changeover tables/feeders or SIPLACE wafer systems for 4-inch to 12-inch wafers
  • Attach unit and linear dipping unit
  • High-precision bare-die placement for embedded wafer level ball grid array
  • NEW: Accuracy of up to 10 µm @ 3 s
  • NEW: Max. board size of 850 mm x 560 mm
  • NEW: Only 2.0 meters long (20 percent less than before)
  • NEW: Can be configured with SIPLACE MultiStar
  • NEW: Minimum placement force of 0.5 N
  • NEW: Linear dipping with improved usability Flux inspection by vision system

More Information

Related topics

SIPLACE SpeedStar

SIPLACE SpeedStar

Extremely fast and with long-term precision

SIPLACE MultiStar

SIPLACE MultiStar

The first head that changes its mode on demand

Best-in-class solutions

Good planning is the basis for efficiency, flexibility and quality in electronics production. As the industry’s technology leader, we offer a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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