Expert voices on topics that move the industry
ASM White Papers shine a light on the electronics industry's current and relevant topics: our DEK and SIPLACE experts take an in-depth look at the latest technology, current hardware and software trends, production challenges and their solutions.
0201m Process
In this white paper are shared results, experiences, challenges and of course ideas around the topic 0201m.
Odd-Shaped Components and Clinching
This white paper describes how the flexible SIPLACE SX placement solution can be used to integrate the place-ment and clinching of THT components into the SMT line’s production flow.
Robustness of Stencils
This white paper was initiated to analyze the impact of various parameters such as stencil tension, number of print cycles, squeegee, stencil wear, and solder paste volumetric transfer efficiencies on the quality of the solder deposit.
DFM HealthCheck
This white paper describes the unique technology of DFM HealthCheck and shows how developers can use this tool, also offered as a service when ordering a stencil at ASM, to save time and money.
Singulated Substrates
This white paper describes the challenges of printing individual substrates simultaneously and describes the different ASM singulated tooling systems created for this purpose.
New capabilities in stencil production
This White Paper covers the details and capabilities of the various methods of electroforming on the basis of a wide range of applications in the fields of SMT, semiconductor manufacturing, and the solar industry.
The role of material management in flexible electronics production
This White Paper covers the rising demands on synchronized material management in electronics production environments – a topic that has been neglected in many factories, but is becoming increasingly important.
All ready for placement: cleverly managing different LED BIN codes & resistors
This White Paper treats challenges arising from the process of binning LEDs and having to pair them with fitting resistors during production, as well as presenting an easy solution to said challenges.