Expert voices on topics that move the industry
ASM White Papers shine a light on the electronics industry's current and relevant topics: our DEK and SIPLACE experts take an in-depth look at the latest technology, current hardware and software trends, production challenges and their solutions.
Open Automation
These white papers serve as a comprehensive guide for your automation plans and projects. The individual chapters will provide valuable suggestions and information on how you can transition to an optimally automated and thus more productive SMT factory.
The right automation ratio matters
Is more automation always better? No. Partial automation and hybrid processes affect the bottom line more positively in most cases.
Evaluating automation opportunities
Where does automation on SMT lines really make sense? A critical analysis of a typical modern SMT line.
Less floor space – but more room to move
Learn how the use of robots affects topologies and layouts in electronics factories.
Simulation eliminates errors and saves time
Simulations are an essential element for Open Automation, particularly when they are combined with AI technologies.
Step-by-step automation
Retrofits for Automation? See how it works in the area of process optimization – using the example of ASM ProcessExpert.
Openness and standards
See where freedom matters. Open and standardized interfaces such as IPC Hermes and IPC-CFX offer investment protection and reduce costs.
Connection calls for synchronization
Machines and mobile robots are the new coworkers in electronics factories. If everything is connected, it must also be synchronized. Learn how to determine who does what.
On-Board PCB Inspection
This white paper covers the topic of On-Board PCB Inspection, the benefits and typical scenarious, including comparing with AOI and SPI systems.
0201m Process
In this white paper are shared results, experiences, challenges and of course ideas around the topic 0201m.
Odd-Shaped Components and Clinching
This white paper describes how the flexible SIPLACE SX placement solution can be used to integrate the place-ment and clinching of THT components into the SMT line’s production flow.
Robustness of Stencils
This white paper was initiated to analyze the impact of various parameters such as stencil tension, number of print cycles, squeegee, stencil wear, and solder paste volumetric transfer efficiencies on the quality of the solder deposit.
DFM HealthCheck
This white paper describes the unique technology of DFM HealthCheck and shows how developers can use this tool, also offered as a service when ordering a stencil at ASM, to save time and money.
Singulated Substrates
This white paper describes the challenges of printing individual substrates simultaneously and describes the different ASM singulated tooling systems created for this purpose.
New capabilities in stencil production
This White Paper covers the details and capabilities of the various methods of electroforming on the basis of a wide range of applications in the fields of SMT, semiconductor manufacturing, and the solar industry.
The role of material management in flexible electronics production
This White Paper covers the rising demands on synchronized material management in electronics production environments – a topic that has been neglected in many factories, but is becoming increasingly important.
All ready for placement: cleverly managing different LED BIN codes & resistors
This White Paper treats challenges arising from the process of binning LEDs and having to pair them with fitting resistors during production, as well as presenting an easy solution to said challenges.