ASM SMT Solutions Win SMT China Vision Awards
2021 NEPCON China
Shanghai (China), April 23, 2021 – ASM SMT Solutions (ASM) has maintained its position as an innovative industry leader for many years, as proven by the many awards won by the ASM team for its solutions. When the SMT China Vision Awards were presented this month in Shanghai, the new powerful SIPLACE TX micron was honored for “Excellence in Pick-and-Place Machines – High Volume“, while the DEK MASS system prevailed over the competition in the “Screen Printing Systems” category. The two awards were officially presented during the Nepcon Asia trade fair. Based on extremely strict standards including innovation, cost effectiveness, usability, ease of maintenance and advanced processes, the Vison Awards focus on honoring trendsetting innovations in the electronics production field. The judging panel for the SMT China Vision Awards is made up of professors and recognized SMT experts in addition to selected readers of SMT China Magazine.
“It is a great honor that the evaluation committee selected ASM, and we are very proud to be honored by one of the industry’s great trade publications. The awards given to ASM prove our innovative strength and our leading position in the market”, said Eric Zhao, Senior Marketing Manager. “As an advanced global equipment supplier for the electronics manufacturing industry, ASM ensures that its customers can tackle the current Covid-19 challenges. Even in 2020, when the epidemic was at its most serious, we continued to bring first-class software and hardware to the Chinese market. Examples include ASM Remote Smart Factory for remote device support, expert session support and free online learning to help customers improve their efficiency and enhance their competitiveness and resilience. ASM is the industry’s reliable technical partner, focusing on quality, service, and, of course, its customers’ success. “
More efficiency and precision for high-density applications and SiPs
The new SIPLACE TX micron features more speed, precision and flexibility for advanced packaging and high-density applications. With its improved 20-nozzle SIPLACE SpeedStar high-speed placement head, technology leader ASM has managed to raise the machine’s performance by roughly 23 percent to up to 96,000 components per hour while increasing the component spectrum by 37 percent. A single machine covers the three precision classes of 25, 20 and 15 µm @ 3σ, making it possible to operate with component pitches of as little as 50 µm and place 0201m components at full speed. Special functions for thin-die handling deliver significantly higher yields when assembling system-in-package modules or submodules.
High-precision alignment of singulated substrates
DEK MASS (Multiple Alignment of Singulated Substrates) enables the screen printer to print on multiple singulated substrates simultaneously with a single squeegee sweep, and to do this with a never-before-seen level of precision and efficiency. The alignment accuracy of this new ASM tooling reaches an unprecedented ± 4 microns. To do this, each substrate is placed on its own alignment tower with a product-specific vacuum tensioning device, which makes it possible to align all substrates simultaneously and with maximum precision. The bottom line: a significant increase in throughput compared to systems with sequential alignment.
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