Die-chip detection with ASM

Die chipping is a failure mechanism wherein a part or parts of the die break away from the die itself. This can happen during the die sawing process or the die sorting and taping process.

Understanding that die chipping affects the efficiency during placement. ASM developed a method to detect these damaged dies with the existing SIPLACE Vision System, without the use of any additional hardware. By defining the minimum chipping length and width in the software, the vision system is able to recognize whether the component is damaged.

With the die chip detection ability in SIPLACE Vision System, you can

• Ensure that only good dies are assembled on the final product improving overall yield
• No need for additional hardware or retrofits on the equipment
• Ensure that maximum placement quality and productivity during production

For more information, please contact us at: smt-solutions.sg@asmpt.com