Innovative technologies ensure maximum precision and speed. Integrated high-end solder paste measurement system.
- Combines 2D and 3D inspection technologies for industry-leading increased measurement accuracy and reliability
- Innovative projector chip with 8 million addressable micro-mirrors
- Lowest fail rate in the industry with absolutely no compromise (zero false accept)
- Maximum inspection precision leads to a drastic reduction of operator interventions and line stops
- Add on the expert system software ASM ProcessEngine for automated process optimization
- Available with single or dual conveyor
- NEW: ASM ProcessLens reads out inkspot and measures a printed PCB. Status of each panel is whispered to subsequent SIPLACE placement machine and components are placed only on good panels