Controlling the quality of solder paste deposits or checking for contamination in areas reserved for BGAs is very difficult after they have been placed.
On-Board PCB Inspection uses the machine's component camera to check things like the position and quality of solder pads, contaminations and minimum distances and maximum heights of placed components before BGAs or QFPs are placed. The placement machine functions like an AOI system to minimize defects and avoid unnecessary expenses.
Good planning is the basis for efficiency, flexibility and quality in electronics production. As the industry’s technology leader, we offer a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.