Controlling the quality of solder paste deposits or checking for contamination in areas reserved for BGAs is very difficult after they have been placed.
On-Board PCB Inspection uses the machine's PCB camera to check things like paste deposits on solder pads, contaminations on placement area of BGAs or QFPs and positioning of assembled components before shield is placed over. This placement machine option avoids the integration of any inline AOI system between two SIPLACE stations and it minimize defects, avoids unnecessary expenses and ensure best production yield.
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