ENABLING THE DIGITAL WORLD

Touchless placement

ASM Assembly Systems new placement process for very sensitive components. The SIPLACE SpeedStar CP20 head can place fragile components such as dies with precision and control using a placement force of 0 N.

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SIPLACE SpeedStar

SIPLACE SpeedStar

Extremely fast and with long-term precision

SIPLACE SX

SIPLACE SX

Our placement solution for high-mix electronics production

Capacity-on-Demand

Capacity-on-Demand

Scale lines up or down as needed

Best-in-class solutions

Good planning is the basis for efficiency, flexibility and quality in electronics production. As the industry’s technology leader, we offer a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

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