SIPLACE SX -Series: A Proven World Class Solution for Flexible Production
Get to know the most flexible placement platform – reinvented
Equipped with the NEW SIPLACE SpeedStar Head (CP20P2), the latest SIPLACE SX is capable of achieving a benchmark speed of 86,560 cph which is a 17% increase as compared to the earlier generation. This head is capable of handling component size up to 8.2 x 8.2 x 4mm which helps to increase the coverage of the component spectrum and directly has a positive impact to the line performance and line balancing. Placing of the World’s smallest component – 0201m is now a standard with the latest high resolution camera. The increased board handling capability also helps to process PCB board up to 1525mm x 590mm for the single conveyor machine.
The enhanced SIPLACE SX is now more capable to place odd shape components any of your manufacturing needs, be it for Industrial, Aerospace or Automotive industries.
Capable of handling complex components by offering our own customized feeding solutions or working with 3rd Party feeders to integrate them with our machine
Enhanced performance of our three placement heads (SIPLACE SpeedStar, SIPLACE MultiStar and SIPLACE TwinStar) to process heavier, taller and higher placement force-required components
Unique Stereo Measurement feature helps to convert classical 2D vision measurement to 3D images so that Through Hole (THT) components can be placed accurately onto the board without damaging the leads or pins
Equipped with a special option to perform Automatic Clinching of components which helps to take away the manual work of the operators
If you like to know more about the latest SIPLACE SX’s capabilities, you may have a look at our ASM Impact Release Event webpage.
Alternatively, you may refer to the SIPLACE SX brochure.
For more information about the SIPLACE SX or on the ASM Impact Release Event, you can reach us at email@example.com.
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