ASM SMT Solutions Segment participates in SEMICON China 2020
SEMICON China 27 to 29 June
ASM takes part in SEMICON China 2020. As the economy starts to open up in China, this year’s SEMICON China will be held on 27 -29 Jun at the Shanghai New International Expo Centre. Leading the Advanced Packaging technology, visitors can witness market-leading packaging technologies at our ASM booth (E3-3235).
Being a technology leader, ASMPT provides a complete solution for semiconductor advanced packaging technologies.
ASM SMT Solutions has the advanced placement and printing capabilities that address intense product miniaturization, high component densities and modularity. To meet market demand, ASM has developed high-speed, highly accurate platforms to print and place challenging and demand fan-out wafer level (FOWL) and fan-out panel level packaging technologies. While ASM SEMI Solutions renowned in offering high-accuracy back-end semiconductor equipment for wafer level packaging. Marrying both expertise and presenting together at SEMICON, we offer and share powerful knowledge on semiconductor packaging solutions in SEMICON.
At the ASM booth, visitors get to witness the extremely accurate DEK Galaxy printing platform. The DEK Galaxy print platform enables numerous semiconductor processes from extremely precise wafer bumping to ball placement to ultra-fine pitch die pad printing. Boosting a 7-second cycle time, DEK Galaxy is superbly fast, precise, reliable and repeatable. At the front of a SiP line, the DEK Galaxy prints the flux and assures pinpoint accuracy prior to placement. The system’s tooling architecture can accommodate singulated substrates as well as JEDEC carriers for wafer-level processing.
“Relying on the rich packaging experience of our parent company ASMPT, professional research team and a wide range of advanced packaging solutions, we have developed some of the world’s most precise, high-speed platforms for all phases of semiconductor and surface-mount manufacturing," says Mr. Eric Zhao, ASM Senior Manager of Product Marketing.
We look forward to sharing our expertise in Semicon China (Booth: E3-3235) and a good start to the reopening of the economy.
For more information, please contact us at email@example.com.
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