ASM in SEMICON China 2020
Successful and surpassed expectation amidst pandemic
In 27 – 29 Jun, ASM SMT Solutions took part in SEMICON China 2020 in the Shanghai New International Expo Centre. Coming together with ASM’s SEMI business segment for the 1st time in SEMICON China, ASM presented a complete solution for semiconductor advanced packaging technologies. Visitors witnessed demonstrations performed on the DEK Galaxy and were impressed.
Being a technology leader, ASM provides a complete solution for semiconductor advanced packaging technologies.
With ASM SMT Solutions’ advanced placement and printing capabilities that address intense product miniaturization, high component densities and modularity, such as printing and placing of fan-out wafer level and fan-out panel level. And ASM SEMI Solutions offering high-accuracy back-end semiconductor equipment for wafer level packaging, ASM presents and shares powerful knowledge on semiconductor packaging solutions.
At the booth, we displayed the DEK Galaxy printing platform. Boosting a 7-second cycle time, the DEK Galaxy is capable of numerous semiconductor processes from extremely precise wafer bumping to ball placement to ultra-fine pitch die pad printing. Visitors witnessed the fast, precise and reliable platform before them.
It is the first ASM show in China after the pandemic breakout. While we were ensuring that everything goes well at the booth, we also ensured the safety of our visitors and our ASM experts. Visitors and exhibitors were required to wear their masks.
We would like to thank visitors who had visited ASM in Semicon China and we are motivated to see that despite the pandemic and the strict measures in place, it didn’t deter visitors from visiting the Show and our ASM booth. We look forward to sharing our innovations with you on other events soon.
For more information, please contact us at email@example.com.
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