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SIPLACE CA2

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High-speed chip assembly directly from wafer and SMT placement in one machine

Smart devices, 5G communication standards, autonomous driving: Only consistent miniaturization and ever-increasing complexity in electronics make all of this possible. The key technology behind this is System in Packages (SiP): ICs and SMT components are combined into a compact, highly innovative system.

As a hybrid system of SMT placement machine and die bonder, the SIPLACE CA2 can process both SMDs fed via shuttle tables and conveyors and dies directly from the sawn wafer in a single work step. This seamless integration of the die bonding process into the SMT line eliminates the need for dedicated special machines thus enabling more efficient production. With reduced manpower, high connectivity, and integrative data utilization, the SIPLACE CA2 is therefore the ideal solution for the requirements of the Intelligent Factory.

Placement directly from the wafer: more cost-effective and sustainable

Discover the efficiency of direct wafer placement: By eliminating the taping process, operators have fewer replenishment and splicing tasks as well as less effort for material feeding. With full SiP production in 24/7 operation, the SIPLACE CA2 can amortize itself within a year, as it saves an impressive 800 kilometers of tape per year.

Two worlds in one machine

Maximum productivity

Optimize your production processes by processing SMT components and dies directly from the wafer in a single work step.

Two machines - one line

The combination of the SIPLACE CA2 with the SIPLACE TX micron high-speed placement machine from ASMPT is particularly interesting in SiP production: both machines can be installed in one production line and complement each other - for maximum flexibility and maximum yield.

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