Director Product Management
SMT话题聚焦
Smart devices, 5G communication standards, autonomous driving: Only consistent miniaturization and ever-increasing complexity in electronics make all of this possible. The key technology behind this is System in Packages (SiP): ICs and SMT components are combined into a compact, highly innovative system.
As a hybrid system of SMT placement machine and die bonder, the SIPLACE CA2 can process both SMDs fed via shuttle tables and conveyors and dies directly from the sawn wafer in a single work step. This seamless integration of the die bonding process into the SMT line eliminates the need for dedicated special machines thus enabling more efficient production. With reduced manpower, high connectivity, and integrative data utilization, the SIPLACE CA2 is therefore the ideal solution for the requirements of the Intelligent Factory.
Discover the efficiency of direct wafer placement: By eliminating the taping process, operators have fewer replenishment and splicing tasks as well as less effort for material feeding. With full SiP production in 24/7 operation, the SIPLACE CA2 can amortize itself within a year, as it saves an impressive 800 kilometers of tape per year.
Optimize your production processes by processing SMT components and dies directly from the wafer in a single work step.
No taping cost, no associated quality cost of the die-taping process, and no efforts for tape-waste disposal.
Wafer system for up to 50 different wafers with a wafer swap time of less than 10 seconds (“full multi-die capability”). A wafer chuck, flux (linear) dipping unit (LDU) and 10 x 8 mm tape-and-reel feeder tracks can be used parallel to pick up from wafer.
Keep track of data for each die from its source on the wafer to its placement position on the circuit board ("full single-die-level-traceability").
This allows you to operate sustainably and efficiently: die processing directly from the diced wafer not only saves you the entire die-taping process but also significantly reduces tape waste. Within a year, you can save 800 km of tape in 24/7-SiP production.
Thanks to die buffering and process parallelization, the SIPLACE CA2 can place up to 50,000 components per hour directly from wafer with an accuracy of up to 10 μm @ 3 σ.
Multiple high-end vision systems reliably recognize even the smallest components and elements for comprehensive process control.
产品手册
The combination of the SIPLACE CA2 with the SIPLACE TX micron high-speed placement machine from ASMPT is particularly interesting in SiP production: both machines can be installed in one production line and complement each other - for maximum flexibility and maximum yield.
预约远程演示
优良的生产计划是确保电子生产效率、灵活性和产品质量的基础。作为行业的技术领导者,我们提供广泛的产品组合。我们的解决方案以优质的硬件、软件和服务而闻名—强大、智能,并随时准备将您的生产提升到一个新的水平。