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Series 2

OSC and THT Assembly with the Flexibility, Speed and Process Control of Modern Placement Machines

Many electronics factories place THT components and OSCs in special processes and/or with special machines, which costs time and money and frequently subjects the components to additional mechanical and thermal stresses.

Processing them on standard placement machines would not only be much more attractive in terms of process technology, but also be much more economical. This series of webinars uses practical examples to demonstrate step-by-step how THT components and OSCs can be processed extremely efficiently with DEK printers, ASM SPI systems and SIPLACE placement solutions.

Register now for Series 2 webinars!

Please select at least one webinar.

All Series 2 webinars

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