✕
Fuyan Yang

Director Product Management
Placement Solutions

Inquiry
 
ASMPT SMT Solutions
  • Home
  • Products
  • Company
  • News Center
  • Competence Network
  • MyASMPT
  • Career
  • Contact

SMT topics in focus

Interaktives eMagazin
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back
Back

SMT topics in focus

Interaktives eMagazin

SIPLACE OSC Package

Master all challenges

 

With SIPLACE equipment, the perfect interaction between placement head and vision system makes it easy to master the challenges posed by OSCs.

  • Placement forces of up to 100 N
  • Snap-in recognition
  • Real-time 3D measurement of contact pins
  • Automatic placement speed optimization
  • Automatic illumination setting for OSC components
  • Crack detection -Component cracks can be identified via the PCB camera inspection prior to pick up as shown in the pictures (i.e. at bare dies)
  • Component weight up to 300 g 
  • NEW: Measure moment of inertia

Related topics

LED Centering

LED Centering

Align LEDs at the precise center

Read more
SIPLACE Placement Head CPP

SIPLACE Placement Head CPP

The first head that changes its mode on demand

Read more
SIPLACE Placement Head TWIN

SIPLACE Placement Head TWIN

Intelligent and forceful

Read more
Corporate Information
Products
Tools
Social Media
© ASMPT SMT Solutions 2024 | Legal notice | Privacy Policy | Terms of Use | Terms & Conditions | Cookie Settings | Gender Pay Gap | Section 172 Statement | Modern Slavery Statement

Best-in-class solutions

As the industry’s technology leader, ASMPT offers a broad portfolio of best-in-class products. Our solutions stand out with their perfect interaction of hardware, software and service components – powerful, smart, and ready to raise your production to a new level.

Wählen Sie Ihre bevorzugte Sprache

Deutsch | Englisch | Chinesisch

Choose your preferred language

German | English | Chinese

请选择语言

德语 | 英语 | 中文