Thank you for visiting ASM Back End Systems at Productronica


    You experienced for the first time a complete solution chain for advanced packaging

    ASM is the world’s only equipment supplier with solutions for all phases and process steps in the electronics industry – from lead frame to backend to SMT. ASM‘s unique process and industry expertise flow into its advanced packaging offerings. This enables ASM to offer solutions for each specific process from a single source with complete, integrated solution chains ranging from sophisticated printing processes to the combined placement of dies, flip-chips and SMT components to molding, singulation, testing and packaging – designed for thie specific process, everything from a single source.

    At Productronica you were able to convince yourself of the solution chain for Wafer Level System in Package (WLSiP):

    • DEK Galaxy – Direct deposition of flux and solder paste or ball drop on wafer
    • ASM Eform – Stencils specifically designed for AP deposition applications
    • SIPLACE CA – FC+DA from Wafer and SMD from Tape & Reel in only one machine
    • ORCAS – Flexible molding processes of wafer and panels for different dies or components with highest co-planarity
    • LASER 1205 – Multi-beam laser technology for highly accurate singulation and grooving of Si and mold compound
    • SUNBIRD – High-speed inspection and taping of dies or components for 100% final quality check before the SMT process

    Thank you for visiting us!