• Linear drives for maximum precision: Repeat accuracy of ±12.5 µm @ 2 Cpk (6 sigma) for demanding wafer, substrate and PCB applications

  • ProFlow® DirEKt Imaging technologies for high-precision ball placements

  • Modular: Flexibly configurable with toolings and transport systems for the widest range of wafer and advanced packaging applications

  • SMEMA-compatible interfaces to wafer and flux solutions

  • SECS/GEM interface to higher-level systems
  • Fast: Core cycle time of only 7 seconds

  • Flexible: Product changeovers take less than 2 minutes

  • Easy operation with DEK Instinctiv™ software