ASM SMT Solutions News

 
  • ASM at the SMT Hybrid Packaging 2018: The World Connected25.04.2018

    ASM at the SMT Hybrid Packaging 2018: The World Connected

    Based on a fully coordinated portfolio of solutions in which all components complement each other, ASM experts will exhibit hardware, software, service and support solutions for the smart factory at the SMT Hybrid Packaging show (June 5-7, Nuremberg, Hall 4, Booth 309). The focus of this year's presentation will lie on eliminating isolated production cells by optimizing and integrating typical workflows within and beyond the SMT production line.

     
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  • SIPLACE TX: More performance, more flexibility25.04.2018

    SIPLACE TX: More performance, more flexibility

    The new version of the SIPLACE TX further expands on its core strengths: with its improved SIPLACE SpeedStar head, which places components ranging from 0201 metric to 8 x 8 x 2 mm, the SIPLACE TX becomes even faster with speeds of up to 95,000 cph. New options like the Long Board Option and Smart Pin Support make the placement platform even more flexible.

     
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  • Precise print results for fine pitch applications: DEK Nano Ultra Coating25.04.2018

    Precise print results for fine pitch applications: DEK Nano Ultra Coating

    As the ratio of aperture area and wall thickness ("area ratio") becomes less favorable, the quality of stencil printing tends to decline. After a lot of research, the specialists of ASM Assembly Systems have now come up with an answer to this dilemma that pushes the traditional limits in the field.

     
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  • ASM SUNBIRD & SIPLACE TX micron: More efficient placement of flip-chips25.04.2018

    ASM SUNBIRD & SIPLACE TX micron: More efficient placement of flip-chips

    ASM, the world’s largest equipment provider for the entire process chain in electronics manufacturing, will be present with its Back End Systems Division at the PCIM trade fair in Nuremberg (june 5-7). Booth 6-123 will also be the site of an innovative premiere for flip-chip placement applications. While inline solutions with die bonders reduce the productivity and flexibility of SMT placement lines, ASM offers a smart combination solution to decouple the wafer handling from the flip-chip placement process.

     
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  • SMT Smart Network: The ASM electronics factory in Munich25.04.2018

    SMT Smart Network: The ASM electronics factory in Munich

    As a maker of machines for SMT manufacturers, ASM must meet the challenges of modern production in its own operations, which is why the company operates one of the world's most modern and flexible electronics factories in Munich. In addition to producing small lots of electronic modules for ASM's own machines, the plant supports ASM’s R&D operations with electronics for prototypes, new options, and custom solutions.

     
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  • NEW: SMT Learning videos – experience smart ASM features on video29.03.2018

    NEW: SMT Learning videos – experience smart ASM features on video

    With the new series of SMT Learning videos, ASM users can learn on their PC how to apply smart new features that will enhance the productivity of their equipment. Experts from the SMT CoC demonstrate the necessary steps directly on the SMT line.

     
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