ASM SMT Solutions Press

 
  • Faster, more accurate, more flexible:Premium SIPLACE TX platform features major improvements12.07.2018

    Faster, more accurate, more flexible:
    Premium SIPLACE TX platform features major improvements

    SIPLACE TX placement modules are known for setting industry records in performance, accuracy and space efficiency. Now technology leader ASM is pushing the envelope to the limit by presenting a new version of its premium platform that features major improvements. Equipped with the new SpeedStar head, the new model's placement performance has been increased by another 23 percent to up to 96,000 cph (components per hour), while its component spectrum now ranges from 0201 (metric) to 8.2 x 8.2 mm. Other advantages of the new model include reduced power consumption and the planned long-board option for boards with lengths of up to 510 mm.

     
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  • ASM considers SMT Hybrid Packaging 2018 a great successThe World Connected: ASM scores with smart workflows12.06.2018

    ASM considers SMT Hybrid Packaging 2018 a great success
    The World Connected: ASM scores with smart workflows

    For three days, industry visitors congregated at the SMT Hybrid Packaging 2018 trade show in Nuremberg under the large "The World Connected" banner at the ASM booth. The technology leader’s exhibits and presentations focused on connecting and optimizing central workflows in electronics manufacturing.  Standouts included an improved version of the SIPLACE TX high-end platform and new E by ASM offerings for high-mix applications in the mid-speed performance range.

     
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  • ASM Back End Systems at PCIM Nuremberg: More efficient placement of flip-chips30.04.2018

    ASM Back End Systems at PCIM Nuremberg:
    More efficient placement of flip-chips

    ASM, the world’s largest equipment provider for the entire process chain in electronics manufacturing, will be present with its Back End Systems Division at the PCIM trade fair in Nuremberg. Booth 6-123 will also be the site of an innovative premiere for flip-chip placement applications. While inline solutions with die bonders reduce the productivity and flexibility of SMT placement lines, ASM offers a smart combination solution to decouple the wafer handling from the flip-chip placement process. The combination of the SUNBIRD inspection and packaging solution and the SIPLACE TX micron machine, which is optimized for flip-chip placement, improves not only the process stability and yield rates, but delivers significantly more productivity with speeds of up to 78,000 cph (components per hour) for the production of small modules, submodules and SiPs (system-in-package products). 

     
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  • Schedule 2018: Better print quality, smart factory workflows, remote webinars and much moreASM’s SMT Center of Competence Days offer individual counselling, solutions to boost production efficiency08.02.2018

    Schedule 2018: Better print quality, smart factory workflows, remote webinars and much more
    ASM’s SMT Center of Competence Days offer individual counselling, solutions to boost production efficiency

    Technology leader ASM Assembly Systems is expanding the number of events as well as their topics and formats at the SMT Center of Competence (CoC) in Munich. The CoC impresses visitors with a fully operational SMT production line featuring line-adjacent operations, technologies and machines. The ASM team uses these capabilities for workshops as well as process and application consulting services in open and customer-specific events. Clear goal of these CoC events: participants learn about smart features and functions that boost quality and efficiency of their typical SMT processes and match their specific fields of interest. In their new "Smart SMT Factory Workshops", ASM's process experts focus on eight central workflows that virtually every customer has to contend with.

     
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  • In time for the 2017 Productronica show: First implementations of the successor to SMEMAGreat interest in The Hermes Standard20.12.2017

    In time for the 2017 Productronica show: First implementations of the successor to SMEMA
    Great interest in The Hermes Standard

    With a successful meeting of all 28 active participants on the day before the official start of the fair and a major "go live" event on its first day, informative panel discussions and first implementation projects, the new standard for machine-to-machine communication in SMT lines had its impressive premiere at the 2017 Productronica trade show.

     
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  • ASM at productronica 2017Many innovations for the Smart Factory14.08.2017

    ASM at productronica 2017
    Many innovations for the Smart Factory

    For productronica 2017, November 14-17, Munich fair ground, ASM has announced a strong focus on the Smart Factory. The SMT equipment supplier and technology leader will be addressing electronics manufacturers’ most current challenges: three different ASM production lines and various expert stations will feature many innovations designed to drive automation and integration on the SMT shop floor. Following the motto „SMT Smart Network: Your Check-In to the Smart Factory", ASM invites show visitors to get inspired by visionary electronics productions from all over the world and join the SMT Smart Network – a globe-spanning competence network of electronics manufacturers, solutions partners, ASM distributors and ASM teams. The show booth features matching solutions: ASM will display smart, comprehensive tool and system chains for multiple line and factory workflows. Gabriela Reckewerth, Senior Director Global Marketing at ASM explains:

     
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