ASM SMT Solutions Press

 
  • True teamwork and high process standardsASM production network named "Factory of the Year"28.01.2019

    True teamwork and high process standards
    ASM production network named "Factory of the Year"

    ASM’s SMT Solutions segment, the technology leader for machines and solutions for the electronic manufacturing industry, has won the 2018 Factory of the Year/Global Excellence in Operations (GEO) Award in the Excellent Production Network category. The benchmarking award, which has been sponsored since 1992 by Produktion magazine and consultancy A.T. Kearney, is one of the most coveted honors for manufacturing companies. After 2012 and 2016, this is the third time ASM has won the Factory of the Year award. This time, the panel of judges recognized especially the high level of common standards within ASM’s global production network with its plants in Munich, Weymouth, Singapore, and Malaysia.  The awards will be officially presented during the Factory of the Year Congress, which will be held March 20-22 in Ludwigsburg, Germany.

     
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  • ASMPT Announces 2018 Third Quarter Results New Records for the First Nine Months08.11.2018

    ASMPT Announces 2018 Third Quarter Results
    New Records for the First Nine Months

    The world’s No.1 semiconductor assembly and packaging equipment supplier ASM Pacific Technology Limited ("ASMPT" / the "Group") today announced its results for the third quarter and the nine months ended 30 September 2018. The Group continued to deliver solid performance, driven largely by the SMT Solutions and the Back-end Equipment Segments. All three segments achieved new records in the period and the Group is on track to set new booking and billing records for the full year of 2018.
    ASMPT reported a revenue of HK$5.17 billion in the three months ended 30 September 2018, representing an increase of 1.1% as compared with HK$5.11 billion for the same period last year. The Group’s consolidated profit after taxation for the three months was HK$602.1 million, which was 30.2% lower than the corresponding period in 2017.

     
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  • Next Generation IPC-SMEMA-Standard The Hermes Standard has become IPC-HERMES-985227.08.2018

    Next Generation IPC-SMEMA-Standard
    The Hermes Standard has become IPC-HERMES-9852

    IPC has confirmed that they recognize The Hermes Standard to be the next generation solution to "the SMEMA Standard" IPC-SMEMA-9851. Accordingly, The Hermes Standard was assigned an IPC naming code: it can now officially be referred to as IPC-HERMES-9852. This strong acknowledgement means a lot for further enhancements of the global footprint and acceptance of The Hermes Standard as it is entering the second stage in global market penetration. Customers and vendors alike will strongly benefit from this new level of standardization progress. Obstacles with regards to implementing "smart factory" features will be dramatically reduced or removed. Electronics manufacturers joining the movement will see another strong boost in their long-term competitiveness.

     
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  • OEM Increases Capacity, Capability with High-Performance Mid-Speed Placement SolutionUS Digital Selects ASM Assembly Systems’ E by SIPLACE Platform for Advanced Encoder Manufacture17.08.2018

    OEM Increases Capacity, Capability with High-Performance Mid-Speed Placement Solution
    US Digital Selects ASM Assembly Systems’ E by SIPLACE Platform for Advanced Encoder Manufacture

    Continuing its nearly 15-year partnership with ASM Assembly Systems (ASM), Vancouver, WA-based OEM US Digital has selected an ASM E by SIPLACE system to modernize its placement capability with a faster, feature-rich platform.   The new addition to its SMT line replaces a SIPLACE CF system, which the company has utilized successfully for the last 14 years but is not equipped with the advanced technology needed for greater capacity and today’s broader component range.

     
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  • 01.08.2018

    ASMPT To Invest in SMART Factory Software Solutions

    ASM Pacific Technology Limited ("ASMPT") is pleased to announce its strategic investment in a software developer Critical Manufacturing, S.A. ("Critical Manufacturing"), which is headquartered in Porto, Portugal.  Critical Manufacturing is a leading software developer and publisher of state-of-the-art manufacturing execution systems (MES).  As an experienced software solutions provider of state-of-the-art MES platforms, Critical Manufacturing has significant expertise in the integration and networking of machines and systems, as well as IT systems and cloud solutions. This strategic investment would accelerate ASMPT’s efforts to build a portfolio of Industry 4.0 solutions and will boost ASMPT’s software competence in enabling smart factories.

     
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  • Faster, more accurate, more flexible:Premium SIPLACE TX platform features major improvements12.07.2018

    Faster, more accurate, more flexible:
    Premium SIPLACE TX platform features major improvements

    SIPLACE TX placement modules are known for setting industry records in performance, accuracy and space efficiency. Now technology leader ASM is pushing the envelope to the limit by presenting a new version of its premium platform that features major improvements. Equipped with the new SpeedStar head, the new model's placement performance has been increased by another 23 percent to up to 96,000 cph (components per hour), while its component spectrum now ranges from 0201 (metric) to 8.2 x 8.2 mm. Other advantages of the new model include reduced power consumption and the planned long-board option for boards with lengths of up to 510 mm.

     
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  • ASM Back End Systems at PCIM Nuremberg: More efficient placement of flip-chips30.04.2018

    ASM Back End Systems at PCIM Nuremberg:
    More efficient placement of flip-chips

    ASM, the world’s largest equipment provider for the entire process chain in electronics manufacturing, will be present with its Back End Systems Division at the PCIM trade fair in Nuremberg. Booth 6-123 will also be the site of an innovative premiere for flip-chip placement applications. While inline solutions with die bonders reduce the productivity and flexibility of SMT placement lines, ASM offers a smart combination solution to decouple the wafer handling from the flip-chip placement process. The combination of the SUNBIRD inspection and packaging solution and the SIPLACE TX micron machine, which is optimized for flip-chip placement, improves not only the process stability and yield rates, but delivers significantly more productivity with speeds of up to 78,000 cph (components per hour) for the production of small modules, submodules and SiPs (system-in-package products). 

     
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